Nvidia CEO Jensen Huang unveiled the Groq 3 Language Processing Unit (LPU), marking the first chip release from the AI ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Abstract: Multimodal sensing promises more robust environmental understanding for pervasive computing applications, but implementing sophisticated sensor fusion on resource-constrained devices remains ...
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