Yield loss is increasingly driven by molecular variability in thin films, interfaces, and contamination rather than visible defects. Reliability issues often appear first as parametric drift or margin ...

Engineers leverage both device-specific and tool-level data to identify a process “sweet spot.” Tight, frequent tool-to-tool matching enables greater yield and fab flexibility. Machine learning helps ...

Digital twins are gaining traction as a way of testing different options at every step of the design-through-manufacturing flow. AI can be used to glue together disparate data types in multi-physics ...

LLM-aided interface for Open Source Chip Design,” was published by researchers at University of Bristol and Rutherford Appleton Laboratory. Abstract “The growing complexity of hardware design and the ...

Researchers from ETH Zurich published the new technical paper “Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding.” Abstract “Transformer-based large language models are ...

A new technical paper, “An Integrated Failure and Threat Mode and Effect Analysis (FTMEA) Framework with Quantified Cross-Domain Correlation Factors for Automotive Semiconductors,” was published by ...

Existing SpaceX Falcon9 rockets can carry about 17,500 kg into LEO, or about 12 Nvidia GB200 NVL72 racks worth of electronics ...

Reflections from inside an industry undergoing its biggest transformation in decades.

Researchers from Ulsan National Institute of Science and Technology (UNIST) designed a low power semiconductor circuit ...

OEMs are driving faster design cycles and enhanced security amid evolving vehicle architectures and compliance requirements.

The automotive and industrial markets are undergoing rapid transformation, driven by Advanced Driver Assistance Systems (ADAS ...

Traditional Ethernet security mechanisms were not designed for the scaling and trust assumptions of next‑generation networks.